MT58L256L32DS-6IT
vs
AS7C33256NTF32A-85TQIN
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Transferred
Transferred
Ihs Manufacturer
MICRON TECHNOLOGY INC
ALLIANCE SEMICONDUCTOR CORP
Part Package Code
QFP
QFP
Package Description
LQFP,
LQFP,
Pin Count
100
100
Reach Compliance Code
unknown
unknown
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
3.5 ns
8.5 ns
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
Length
20 mm
20 mm
Memory Density
8388608 bit
8388608 bit
Memory IC Type
CACHE SRAM
ZBT SRAM
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
256KX32
256KX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Supply Voltage-Max (Vsup)
3.6 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
Base Number Matches
1
1
Rohs Code
Additional Feature
FLOW-THROUGH ARCHITECTURE
JESD-609 Code
e3
Terminal Finish
MATTE TIN
Compare MT58L256L32DS-6IT with alternatives
Compare AS7C33256NTF32A-85TQIN with alternatives