MT57W2MH8BF-4 vs MT54W2MH8BF-5 feature comparison

MT57W2MH8BF-4 Micron Technology Inc

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MT54W2MH8BF-5 Rochester Electronics LLC

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Rohs Code No
Part Life Cycle Code Transferred Active
Ihs Manufacturer MICRON TECHNOLOGY INC ROCHESTER ELECTRONICS LLC
Part Package Code BGA BGA
Package Description 13 X 15 MM, 1 MM PITCH, FBGA-165 13 X 15 MM, 1 MM PITCH, FBGA-165
Pin Count 165 165
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Access Time-Max 0.45 ns 0.45 ns
Additional Feature PIPELINED ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 250 MHz
I/O Type COMMON
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0 e1
Length 15 mm 15 mm
Memory Density 16777216 bit 16777216 bit
Memory IC Type DDR SRAM QDR SRAM
Memory Width 8 8
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 2MX8 2MX8
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA TBGA
Package Equivalence Code BGA165,11X15,40
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, THIN PROFILE
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified COMMERCIAL
Seated Height-Max 1.2 mm 1.2 mm
Standby Current-Max 0.2 A
Standby Voltage-Min 1.7 V
Supply Current-Max 0.4 mA
Supply Voltage-Max (Vsup) 1.9 V 1.9 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Width 13 mm 13 mm
Base Number Matches 2 3

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