MT55V256V72F10H
vs
GS8171DW72AGC-250T
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
GSI TECHNOLOGY
Part Package Code
BGA
BGA
Package Description
BGA,
14 X 22 MM, 1 MM PITCH, LEAD FREE, BGA-209
Pin Count
209
209
Reach Compliance Code
unknown
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
7.5 ns
2.1 ns
JESD-30 Code
R-PBGA-B209
R-PBGA-B209
JESD-609 Code
e1
e1
Length
22 mm
22 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
ZBT SRAM
STANDARD SRAM
Memory Width
72
72
Number of Functions
1
1
Number of Terminals
209
209
Number of Words
262144 words
262144 words
Number of Words Code
256000
256000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
256KX72
256KX72
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
LBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
2.2 mm
1.7 mm
Supply Voltage-Max (Vsup)
2.625 V
1.95 V
Supply Voltage-Min (Vsup)
2.375 V
1.7 V
Supply Voltage-Nom (Vsup)
2.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
14 mm
14 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Additional Feature
PIPELINED ARCHITECTURE
Moisture Sensitivity Level
3
Peak Reflow Temperature (Cel)
260
Compare MT55V256V72F10H with alternatives
Compare GS8171DW72AGC-250T with alternatives