MT55V1MV18FT-11 vs MCM63P819KZP150R feature comparison

MT55V1MV18FT-11 Micron Technology Inc

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MCM63P819KZP150R Freescale Semiconductor

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Rohs Code No
Part Life Cycle Code Transferred Transferred
Ihs Manufacturer MICRON TECHNOLOGY INC FREESCALE SEMICONDUCTOR INC
Part Package Code QFP BGA
Package Description PLASTIC, TQFP-100 BGA,
Pin Count 100 119
Reach Compliance Code not_compliant unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Factory Lead Time 4 Weeks
Access Time-Max 8.5 ns 3.8 ns
Additional Feature FLOW-THROUGH ARCHITECTURE PIPELINED ARCHITECTURE
Clock Frequency-Max (fCLK) 90 MHz
I/O Type COMMON
JESD-30 Code R-PQFP-G100 R-PBGA-B119
JESD-609 Code e0
Length 20 mm 22 mm
Memory Density 18874368 bit 4718592 bit
Memory IC Type ZBT SRAM CACHE SRAM
Memory Width 18 18
Number of Functions 1 1
Number of Terminals 100 119
Number of Words 1048576 words 262144 words
Number of Words Code 1000000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 1MX18 256KX18
Output Characteristics 3-STATE
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LQFP BGA
Package Equivalence Code QFP100,.63X.87
Package Shape RECTANGULAR RECTANGULAR
Package Style FLATPACK, LOW PROFILE GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.6 mm 2.4 mm
Standby Current-Max 0.03 A
Standby Voltage-Min 2.38 V
Supply Current-Max 0.175 mA
Supply Voltage-Max (Vsup) 2.625 V 3.465 V
Supply Voltage-Min (Vsup) 2.375 V 3.135 V
Supply Voltage-Nom (Vsup) 2.5 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb)
Terminal Form GULL WING BALL
Terminal Pitch 0.65 mm 1.27 mm
Terminal Position QUAD BOTTOM
Width 14 mm 14 mm
Base Number Matches 2 1

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