MT55L512Y36PF-5 vs AS7C331MNTD36A-167BCN feature comparison

MT55L512Y36PF-5 Cypress Semiconductor

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AS7C331MNTD36A-167BCN Integrated Silicon Solution Inc

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Pbfree Code No Yes
Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP INTEGRATED SILICON SOLUTION INC
Part Package Code BGA BGA
Package Description TBGA, LBGA,
Pin Count 165 165
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.2 ns 7.5 ns
Additional Feature PIPELINED ARCHITECTURE FLOW-THROUGH OR PIPELINED ARCHITECTURE
JESD-30 Code R-PBGA-B165 R-PBGA-B165
JESD-609 Code e0 e3
Length 15 mm 17 mm
Memory Density 18874368 bit 37748736 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 36 36
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 165 165
Number of Words 524288 words 1048576 words
Number of Words Code 512000 1000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min
Organization 512KX36 1MX36
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TBGA LBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE GRID ARRAY, LOW PROFILE
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.2 mm 1.46 mm
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish Tin/Lead (Sn/Pb) MATTE TIN
Terminal Form BALL BALL
Terminal Pitch 1 mm 1 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 13 mm 15 mm
Base Number Matches 2 2

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