MT55L256L32PB-6 vs MT55L256V32PB-7.5IT feature comparison

MT55L256L32PB-6 Cypress Semiconductor

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MT55L256V32PB-7.5IT Micron Technology Inc

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Rohs Code No
Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer CYPRESS SEMICONDUCTOR CORP MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description BGA, BGA,
Pin Count 119 119
Reach Compliance Code unknown unknown
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Access Time-Max 3.5 ns 4.2 ns
JESD-30 Code R-PBGA-B119 R-PBGA-B119
JESD-609 Code e0 e1
Length 22 mm 22 mm
Memory Density 8388608 bit 8388608 bit
Memory IC Type ZBT SRAM ZBT SRAM
Memory Width 32 32
Moisture Sensitivity Level 3
Number of Functions 1 1
Number of Terminals 119 119
Number of Words 262144 words 262144 words
Number of Words Code 256000 256000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 85 °C
Operating Temperature-Min -40 °C
Organization 256KX32 256KX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code BGA BGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY GRID ARRAY
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified Not Qualified
Seated Height-Max 2.4 mm 2.4 mm
Supply Voltage-Max (Vsup) 3.465 V 3.465 V
Supply Voltage-Min (Vsup) 3.135 V 3.135 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL INDUSTRIAL
Terminal Finish Tin/Lead (Sn/Pb) TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 1.27 mm 1.27 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED
Width 14 mm 14 mm
Base Number Matches 2 2

Compare MT55L256L32PB-6 with alternatives

Compare MT55L256V32PB-7.5IT with alternatives