MT55L1MY18PT-6
vs
CY7C1372D-200AXI
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
ROCHESTER ELECTRONICS LLC
CYPRESS SEMICONDUCTOR CORP
Part Package Code
QFP
QFP
Package Description
PLASTIC, TQFP-100
(14 X 20 X 1.4) MM, LEAD FREE, PLASTIC, TQFP-100
Pin Count
100
100
Reach Compliance Code
unknown
unknown
Access Time-Max
3.5 ns
3 ns
Additional Feature
PIPELINED ARCHITECTURE
PIPELINED ARCHITECTURE
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
Length
20 mm
20 mm
Memory Density
18874368 bit
18874368 bit
Memory IC Type
ZBT SRAM
ZBT SRAM
Memory Width
18
18
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
1048576 words
1048576 words
Number of Words Code
1000000
1000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
1MX18
1MX18
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
COMMERCIAL
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Supply Voltage-Max (Vsup)
3.465 V
3.6 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
Base Number Matches
3
1
Rohs Code
ECCN Code
3A991.B.2.A
HTS Code
8542.32.00.41
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
JESD-609 Code
e3
Moisture Sensitivity Level
3
Output Characteristics
3-STATE
Package Equivalence Code
QFP100,.63X.87
Peak Reflow Temperature (Cel)
260
Standby Current-Max
0.07 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.3 mA
Terminal Finish
MATTE TIN
Time@Peak Reflow Temperature-Max (s)
40
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