MT55L128V32P1T-10
vs
AS7C33128FT32B-80TQCN
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Transferred
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
QFP
QFP
Package Description
PLASTIC, MS-026, TQFP-100
LQFP,
Pin Count
100
100
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
5 ns
8 ns
Additional Feature
PIPELINED ARCHITECTURE
FLOW-THROUGH ARCHITECTURE
Clock Frequency-Max (fCLK)
100 MHz
I/O Type
COMMON
JESD-30 Code
R-PQFP-G100
R-PQFP-G100
JESD-609 Code
e0
e3
Length
20 mm
20 mm
Memory Density
4194304 bit
4194304 bit
Memory IC Type
ZBT SRAM
STANDARD SRAM
Memory Width
32
32
Number of Functions
1
1
Number of Terminals
100
100
Number of Words
131072 words
131072 words
Number of Words Code
128000
128000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
128KX32
128KX32
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
LQFP
LQFP
Package Equivalence Code
QFP100,.63X.87
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
FLATPACK, LOW PROFILE
FLATPACK, LOW PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.6 mm
1.6 mm
Standby Current-Max
0.01 A
Standby Voltage-Min
3.14 V
Supply Current-Max
0.3 mA
Supply Voltage-Max (Vsup)
3.465 V
3.465 V
Supply Voltage-Min (Vsup)
3.135 V
3.135 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
Tin/Lead (Sn/Pb)
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.65 mm
0.65 mm
Terminal Position
QUAD
QUAD
Width
14 mm
14 mm
Base Number Matches
2
2
Pbfree Code
Compare MT55L128V32P1T-10 with alternatives
Compare AS7C33128FT32B-80TQCN with alternatives