MT52C9005EJ-25AT
vs
CMUI-67201AV-55SHXXX
feature comparison
| Pbfree Code |
No
|
|
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Transferred
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
TEMIC SEMICONDUCTORS
|
| Part Package Code |
QFJ
|
|
| Package Description |
PLASTIC, LCC-32
|
|
| Pin Count |
32
|
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
|
| HTS Code |
8542.32.00.71
|
|
| Access Time-Max |
25 ns
|
55 ns
|
| Additional Feature |
RETRANSMIT
|
|
| Cycle Time |
35 ns
|
70 ns
|
| JESD-30 Code |
R-PQCC-J32
|
R-PDSO-J28
|
| JESD-609 Code |
e0
|
|
| Length |
13.97 mm
|
|
| Memory Density |
4608 bit
|
4608 bit
|
| Memory IC Type |
OTHER FIFO
|
|
| Memory Width |
9
|
9
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
32
|
28
|
| Number of Words |
512 words
|
512 words
|
| Number of Words Code |
512
|
512
|
| Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
| Operating Temperature-Max |
125 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
512X9
|
512X9
|
| Output Enable |
NO
|
NO
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
QCCJ
|
|
| Package Equivalence Code |
LDCC32,.5X.6
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
CHIP CARRIER
|
SMALL OUTLINE
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
3.81 mm
|
|
| Standby Current-Max |
0.005 A
|
|
| Supply Current-Max |
0.12 mA
|
|
| Supply Voltage-Max (Vsup) |
5.5 V
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
4.5 V
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
5 V
|
5 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
AUTOMOTIVE
|
COMMERCIAL
|
| Terminal Finish |
TIN LEAD
|
|
| Terminal Form |
J BEND
|
J BEND
|
| Terminal Pitch |
1.27 mm
|
|
| Terminal Position |
QUAD
|
DUAL
|
| Width |
11.43 mm
|
|
| Base Number Matches |
1
|
2
|
| Output Characteristics |
|
3-STATE
|
|
|
|
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