MT4LSDT1664AG-133
vs
MT4LSDT1664AY-133
feature comparison
| Pbfree Code |
No
|
Yes
|
| Rohs Code |
No
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
| Reach Compliance Code |
unknown
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.32
|
8542.32.00.32
|
| Date Of Intro |
1998-01-01
|
|
| Access Time-Max |
5.4 ns
|
5.4 ns
|
| Clock Frequency-Max (fCLK) |
133 MHz
|
133 MHz
|
| I/O Type |
COMMON
|
COMMON
|
| JESD-30 Code |
R-PDMA-N168
|
R-PDMA-N168
|
| Memory Density |
1073741824 bit
|
1073741824 bit
|
| Memory IC Type |
SYNCHRONOUS DRAM MODULE
|
SYNCHRONOUS DRAM MODULE
|
| Memory Width |
64
|
64
|
| Moisture Sensitivity Level |
1
|
1
|
| Number of Terminals |
168
|
168
|
| Number of Words |
16777216 words
|
16777216 words
|
| Number of Words Code |
16000000
|
16000000
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
16MX64
|
16MX64
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
DIMM
|
DIMM
|
| Package Equivalence Code |
DIMM168
|
DIMM168
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
MICROELECTRONIC ASSEMBLY
|
MICROELECTRONIC ASSEMBLY
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
8192
|
8192
|
| Standby Current-Max |
0.008 A
|
0.008 A
|
| Supply Current-Max |
1.08 mA
|
1.08 mA
|
| Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
| Surface Mount |
NO
|
NO
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Form |
NO LEAD
|
NO LEAD
|
| Terminal Pitch |
1.27 mm
|
1.27 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
5
|
4
|
| Package Description |
|
DIMM, DIMM168
|
| JESD-609 Code |
|
e3
|
| Terminal Finish |
|
MATTE TIN
|
|
|
|
Compare MT4LSDT1664AG-133 with alternatives
Compare MT4LSDT1664AY-133 with alternatives