MT49H32M9HT-33
vs
MT49H32M9FM-3.3
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
TBGA, BGA144,12X18,40/32
11 X 18.50 MM, MICRO, BGA-144
Pin Count
144
144
Reach Compliance Code
unknown
not_compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Access Time-Max
0.3 ns
Additional Feature
AUTO REFRESH
AUTO REFRESH
Clock Frequency-Max (fCLK)
300 MHz
300 MHz
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B144
R-PBGA-B144
JESD-609 Code
e1
e0
Length
18.5 mm
18.5 mm
Memory Density
301989888 bit
301989888 bit
Memory IC Type
DDR DRAM
DDR DRAM
Memory Width
9
9
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
32MX9
32MX9
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
VBGA
Package Equivalence Code
BGA144,12X18,40/32
BGA144,12X18,40/32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, VERY THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
0.93 mm
Sequential Burst Length
2,4,8
2,4,8
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
11 mm
11 mm
Base Number Matches
1
1
Operating Temperature-Max
95 °C
Operating Temperature-Min
Temperature Grade
OTHER
Compare MT49H32M9HT-33 with alternatives
Compare MT49H32M9FM-3.3 with alternatives