MT49H32M18HU-18:A
vs
GS4576C18GM-25
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
GSI TECHNOLOGY
Part Package Code
BGA
Package Description
FBGA-144
LBGA,
Pin Count
144
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
3A991.B.2.B
HTS Code
8542.32.00.32
8542.32.00
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Access Time-Max
15 ns
Additional Feature
AUTO REFRESH
AUTO REFRESH
Clock Frequency-Max (fCLK)
533 MHz
I/O Type
COMMON
JESD-30 Code
R-PBGA-B144
R-PBGA-B144
Length
18.5 mm
18.5 mm
Memory Density
603979776 bit
603979776 bit
Memory IC Type
DDR DRAM
DDR DRAM
Memory Width
18
18
Moisture Sensitivity Level
1
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
95 °C
95 °C
Operating Temperature-Min
Organization
32MX18
32MX18
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
LBGA
Package Equivalence Code
BGA144,12X18,40/32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, LOW PROFILE
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
1.25 mm
Sequential Burst Length
2,4,8
Standby Current-Max
0.055 A
Supply Current-Max
1.335 mA
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
11 mm
11 mm
Base Number Matches
1
1
Date Of Intro
2017-10-03
Samacsys Manufacturer
GSI TECHNOLOGY
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MT49H32M18HU-18:A with alternatives
Compare GS4576C18GM-25 with alternatives