We use Cookies to give you best experience on our website. By using our website and services, you expressly agree to the placement of our performance, functionality and advertising cookies. Please see our Privacy Policy for more information.

Register or Sign In

MT48LC8M32B2B5-7 vs K4M56323LE-ML1H0 feature comparison

MT48LC8M32B2B5-7 Micron Technology Inc

Buy Now Datasheet

K4M56323LE-ML1H0 Samsung Semiconductor

Buy Now Datasheet
Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC SAMSUNG SEMICONDUCTOR INC
Part Package Code BGA BGA
Package Description VFBGA, BGA90,9X15,32 LFBGA,
Pin Count 90 90
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.24 8542.32.00.24
Samacsys Manufacturer Micron
Access Mode FOUR BANK PAGE BURST FOUR BANK PAGE BURST
Access Time-Max 6 ns 7 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
Clock Frequency-Max (fCLK) 143 MHz
I/O Type COMMON
Interleaved Burst Length 1,2,4,8
JESD-30 Code R-PBGA-B90 R-PBGA-B90
JESD-609 Code e1
Length 13 mm 13 mm
Memory Density 268435456 bit 268435456 bit
Memory IC Type SYNCHRONOUS DRAM SYNCHRONOUS DRAM
Memory Width 32 32
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 90 90
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 70 °C 70 °C
Operating Temperature-Min -25 °C
Organization 8MX32 8MX32
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA LFBGA
Package Equivalence Code BGA90,9X15,32
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, LOW PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Refresh Cycles 4096
Seated Height-Max 1 mm 1.4 mm
Self Refresh YES YES
Sequential Burst Length 1,2,4,8,FP
Standby Current-Max 0.0012 A
Supply Current-Max 0.295 mA
Supply Voltage-Max (Vsup) 3.6 V 2.7 V
Supply Voltage-Min (Vsup) 3 V 2.3 V
Supply Voltage-Nom (Vsup) 3.3 V 2.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade COMMERCIAL OTHER
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 8 mm 11 mm
Base Number Matches 3 1
Memory » DRAMs
Memory » DRAMs

Compare MT48LC8M32B2B5-7 with alternatives

Compare K4M56323LE-ML1H0 with alternatives