MT48LC8M16A2F4-6A
vs
MT48LC8M16A2B4-6AIT:L
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Active
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
JESD-609 Code
e0
e1
Memory IC Type
SYNCHRONOUS DRAM
SYNCHRONOUS DRAM
Terminal Finish
Tin/Lead (Sn/Pb)
TIN SILVER COPPER
Base Number Matches
1
1
Pbfree Code
Part Package Code
BGA
Package Description
VFBGA, BGA54,9X9,32
Pin Count
54
HTS Code
8542.32.00.02
Access Mode
FOUR BANK PAGE BURST
Access Time-Max
5.4 ns
Additional Feature
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
167 MHz
I/O Type
COMMON
Interleaved Burst Length
1,2,4,8
JESD-30 Code
S-PBGA-B54
Length
8 mm
Memory Density
134217728 bit
Memory Width
16
Number of Functions
1
Number of Ports
1
Number of Terminals
54
Number of Words
8388608 words
Number of Words Code
8000000
Operating Mode
SYNCHRONOUS
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Organization
8MX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
Package Code
VFBGA
Package Equivalence Code
BGA54,9X9,32
Package Shape
SQUARE
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Refresh Cycles
4096
Screening Level
AEC-Q100
Seated Height-Max
1 mm
Self Refresh
YES
Sequential Burst Length
1,2,4,8,FP
Standby Current-Max
0.0025 A
Supply Current-Max
0.1 mA
Supply Voltage-Max (Vsup)
3.6 V
Supply Voltage-Min (Vsup)
3 V
Supply Voltage-Nom (Vsup)
3.3 V
Surface Mount
YES
Technology
CMOS
Temperature Grade
INDUSTRIAL
Terminal Form
BALL
Terminal Pitch
0.8 mm
Terminal Position
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
8 mm
Compare MT48LC8M16A2F4-6A with alternatives
Compare MT48LC8M16A2B4-6AIT:L with alternatives