MT48LC4M32B2B5-6AT:G
vs
K4S283233E-HG600
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
SAMSUNG SEMICONDUCTOR INC
Part Package Code
BGA
BGA
Package Description
VFBGA,
TFBGA,
Pin Count
90
90
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
5.5 ns
5.4 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
167 MHz
I/O Type
COMMON
Interleaved Burst Length
1,2,4,8
JESD-30 Code
R-PBGA-B90
R-PBGA-B90
JESD-609 Code
e1
Length
13 mm
13 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
SYNCHRONOUS DRAM
SYNCHRONOUS DRAM
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
90
90
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-25 °C
Organization
4MX32
4MX32
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TFBGA
Package Equivalence Code
BGA90,9X15,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Refresh Cycles
4096
Screening Level
AEC-Q100
Seated Height-Max
1 mm
1.2 mm
Self Refresh
YES
YES
Sequential Burst Length
1,2,4,8,FP
Standby Current-Max
0.002 A
Supply Current-Max
0.18 mA
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
2.7 V
Supply Voltage-Nom (Vsup)
3.3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
9 mm
Base Number Matches
1
1
Qualification Status
Not Qualified
Compare MT48LC4M32B2B5-6AT:G with alternatives
Compare K4S283233E-HG600 with alternatives