MT48LC32M4A2BC-75:G
vs
MT46V32M4FJ-6ES:B
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
TBGA,
Pin Count
60
60
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
5.4 ns
0.7 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e1
e1
Length
13 mm
16 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
SYNCHRONOUS DRAM
DDR DRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
70 °C
Operating Temperature-Min
Organization
32MX4
32MX4
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
3.6 V
2.7 V
Supply Voltage-Min (Vsup)
3 V
2.3 V
Supply Voltage-Nom (Vsup)
3.3 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
11 mm
9 mm
Base Number Matches
1
1
Compare MT48LC32M4A2BC-75:G with alternatives
Compare MT46V32M4FJ-6ES:B with alternatives