MT48LC16M8A2P-6AAT:L
vs
IS42SM81600E-75ETLI
feature comparison
| Part Life Cycle Code |
Active
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
INTEGRATED SILICON SOLUTION INC
|
| Package Description |
,
|
TSOP2,
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| JESD-609 Code |
e3
|
e3
|
| Memory IC Type |
SYNCHRONOUS DRAM
|
SYNCHRONOUS DRAM
|
| Peak Reflow Temperature (Cel) |
260
|
260
|
| Terminal Finish |
MATTE TIN
|
MATTE TIN
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
10
|
| Base Number Matches |
1
|
1
|
| Pbfree Code |
|
Yes
|
| Rohs Code |
|
Yes
|
| Part Package Code |
|
TSOP2
|
| Pin Count |
|
54
|
| HTS Code |
|
8542.32.00.02
|
| Access Mode |
|
FOUR BANK PAGE BURST
|
| Access Time-Max |
|
5.4 ns
|
| Additional Feature |
|
AUTO/SELF REFRESH
|
| JESD-30 Code |
|
R-PDSO-G54
|
| Length |
|
22.22 mm
|
| Memory Density |
|
134217728 bit
|
| Memory Width |
|
8
|
| Number of Functions |
|
1
|
| Number of Ports |
|
1
|
| Number of Terminals |
|
54
|
| Number of Words |
|
16777216 words
|
| Number of Words Code |
|
16000000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
85 °C
|
| Operating Temperature-Min |
|
-40 °C
|
| Organization |
|
16MX8
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TSOP2
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
SMALL OUTLINE, THIN PROFILE
|
| Qualification Status |
|
Not Qualified
|
| Seated Height-Max |
|
1.2 mm
|
| Self Refresh |
|
YES
|
| Supply Voltage-Max (Vsup) |
|
3.6 V
|
| Supply Voltage-Min (Vsup) |
|
3 V
|
| Supply Voltage-Nom (Vsup) |
|
3.3 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
INDUSTRIAL
|
| Terminal Form |
|
GULL WING
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
DUAL
|
| Width |
|
10.16 mm
|
|
|
|
Compare MT48LC16M8A2P-6AAT:L with alternatives
Compare IS42SM81600E-75ETLI with alternatives