MT47J64M16HQ-25E:E
vs
MT46H64M16LGCK-6:A
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
8 X 11.50 MM, ROHS COMPLIANT, FBGA-60
VFBGA,
Pin Count
60
60
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
MULTI BANK PAGE BURST
FOUR BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e1
e1
Length
11.5 mm
11.5 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
DDR2 DRAM
LPDDR1 DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
64MX16
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.625 V
1.95 V
Supply Voltage-Min (Vsup)
1.425 V
1.7 V
Supply Voltage-Nom (Vsup)
1.5 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
10 mm
Base Number Matches
1
1
Access Time-Max
5.5 ns
Operating Temperature-Max
70 °C
Operating Temperature-Min
Temperature Grade
COMMERCIAL
Compare MT47J64M16HQ-25E:E with alternatives
Compare MT46H64M16LGCK-6:A with alternatives