MT47H64M16NF-25E:MTR
vs
MT47H64M16NF-25EIT:MT
feature comparison
All Stats
Differences Only
Rohs Code
Yes
Part Life Cycle Code
Active
Active
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Package Description
FBGA-84
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Additional Feature
SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B84
R-PBGA-B84
JESD-609 Code
e1
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
DDR2 DRAM
DDR2 DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
84
84
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
95 °C
Operating Temperature-Min
-40 °C
Organization
64MX16
64MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
BGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
1
1
Access Time-Max
0.4 ns
Clock Frequency-Max (fCLK)
400 MHz
I/O Type
COMMON
Interleaved Burst Length
4,8
Length
12.5 mm
Output Characteristics
3-STATE
Package Equivalence Code
BGA84,9X15,32
Refresh Cycles
8192
Screening Level
AEC-Q100
Seated Height-Max
1.2 mm
Sequential Burst Length
4,8
Standby Current-Max
0.038 A
Supply Current-Max
0.26 mA
Terminal Pitch
0.8 mm
Width
8 mm
Compare MT47H64M16NF-25E:MTR with alternatives
Compare MT47H64M16NF-25EIT:MT with alternatives