MT47H128M4F6-37EL:D
vs
V59C1512404QDLF19AH
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
PROMOS TECHNOLOGIES INC
Part Package Code
BGA
DSBGA
Package Description
10 X 10 MM, FBGA-60
TFBGA,
Pin Count
60
60
Reach Compliance Code
not_compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.28
8542.32.00.28
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.5 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
266 MHz
I/O Type
COMMON
Interleaved Burst Length
4,8
JESD-30 Code
S-PBGA-B60
R-PBGA-B60
JESD-609 Code
e0
Length
10 mm
10.5 mm
Memory Density
536870912 bit
536870912 bit
Memory IC Type
DDR2 DRAM
DDR DRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
105 °C
Operating Temperature-Min
-40 °C
Organization
128MX4
128MX4
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA60,9X11,32
Package Shape
SQUARE
RECTANGULAR
Package Style
GRID ARRAY
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Sequential Burst Length
4,8
Standby Current-Max
0.007 A
Supply Current-Max
0.225 mA
Supply Voltage-Max (Vsup)
1.9 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
TIN LEAD SILVER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
10 mm
10 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
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