MT47H128M4B6-3ELIT
vs
MT47H128M4B6-3ELIT:D
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Contact Manufacturer
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Package Description
FBGA, BGA60,9X11,32
TFBGA, BGA60,9X11,32
Reach Compliance Code
compliant
compliant
Access Time-Max
0.45 ns
0.45 ns
Clock Frequency-Max (fCLK)
333 MHz
333 MHz
I/O Type
COMMON
COMMON
Interleaved Burst Length
4,8
4,8
JESD-30 Code
R-PBGA-B60
S-PBGA-B60
JESD-609 Code
e3
e1
Memory Density
536870912 bit
536870912 bit
Memory IC Type
DDR DRAM
DDR2 DRAM
Memory Width
4
4
Moisture Sensitivity Level
1
Number of Terminals
60
60
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
128MX4
128MX4
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
FBGA
TFBGA
Package Equivalence Code
BGA60,9X11,32
BGA60,9X11,32
Package Shape
RECTANGULAR
SQUARE
Package Style
GRID ARRAY, FINE PITCH
GRID ARRAY
Peak Reflow Temperature (Cel)
260
Power Supplies
1.8 V
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
8192
Sequential Burst Length
4,8
4,8
Standby Current-Max
0.007 A
0.007 A
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Base Number Matches
1
1
Part Package Code
BGA
Pin Count
60
ECCN Code
EAR99
HTS Code
8542.32.00.28
Access Mode
FOUR BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
Length
10 mm
Number of Functions
1
Number of Ports
1
Operating Mode
SYNCHRONOUS
Seated Height-Max
1.2 mm
Self Refresh
YES
Supply Voltage-Max (Vsup)
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
Width
10 mm
Compare MT47H128M4B6-3ELIT with alternatives
Compare MT47H128M4B6-3ELIT:D with alternatives