MT47H128M16RT-25EAIT:CTR
vs
SCB18T2G160AF-25DX
feature comparison
| Part Life Cycle Code |
Active
|
Contact Manufacturer
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
XIAN UNILC SEMICONDUCTORS CO LTD
|
| Package Description |
,
|
TFBGA,
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| Memory IC Type |
DDR2 DRAM
|
DDR DRAM
|
| Peak Reflow Temperature (Cel) |
260
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Time@Peak Reflow Temperature-Max (s) |
30
|
|
| Base Number Matches |
1
|
1
|
| HTS Code |
|
8542.32.00.36
|
| Access Mode |
|
MULTI BANK PAGE BURST
|
| Access Time-Max |
|
0.4 ns
|
| Additional Feature |
|
AUTO REFRESH
|
| JESD-30 Code |
|
R-PBGA-B84
|
| Length |
|
12.5 mm
|
| Memory Density |
|
2147483648 bit
|
| Memory Width |
|
16
|
| Number of Functions |
|
1
|
| Number of Ports |
|
1
|
| Number of Terminals |
|
84
|
| Number of Words |
|
134217728 words
|
| Number of Words Code |
|
128000000
|
| Operating Mode |
|
SYNCHRONOUS
|
| Operating Temperature-Max |
|
125 °C
|
| Operating Temperature-Min |
|
-55 °C
|
| Organization |
|
128MX16
|
| Package Body Material |
|
PLASTIC/EPOXY
|
| Package Code |
|
TFBGA
|
| Package Shape |
|
RECTANGULAR
|
| Package Style |
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Seated Height-Max |
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
|
1.9 V
|
| Supply Voltage-Min (Vsup) |
|
1.7 V
|
| Supply Voltage-Nom (Vsup) |
|
1.8 V
|
| Surface Mount |
|
YES
|
| Technology |
|
CMOS
|
| Temperature Grade |
|
MILITARY
|
| Terminal Form |
|
BALL
|
| Terminal Pitch |
|
0.8 mm
|
| Terminal Position |
|
BOTTOM
|
| Width |
|
8 mm
|
|
|
|
Compare MT47H128M16RT-25EAIT:CTR with alternatives
Compare SCB18T2G160AF-25DX with alternatives