MT46V32M8BJ-75ZLH
vs
MT46V32M8TG-75ZLITH
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
TSOP
Package Description
TBGA,
TSOP2,
Pin Count
60
66
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.24
8542.32.00.24
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.75 ns
0.75 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B60
R-PDSO-G66
JESD-609 Code
e1
e0
Length
16 mm
22.22 mm
Memory Density
268435456 bit
268435456 bit
Memory IC Type
DDR1 DRAM
DDR1 DRAM
Memory Width
8
8
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
66
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
32MX8
32MX8
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TSOP2
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
SMALL OUTLINE, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
8192
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Current-Max
0.155 mA
0.155 mA
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.3 V
2.3 V
Supply Voltage-Nom (Vsup)
2.5 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
TIN LEAD
Terminal Form
BALL
GULL WING
Terminal Pitch
1 mm
0.65 mm
Terminal Position
BOTTOM
DUAL
Width
9 mm
10.16 mm
Base Number Matches
2
1
Compare MT46V32M8BJ-75ZLH with alternatives
Compare MT46V32M8TG-75ZLITH with alternatives