MT46V32M4FJ-5BIT
vs
MT46V32M4FJ-75ES:D
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
16 X 9 MM, PLASTIC, FBGA-60
TBGA,
Pin Count
60
60
Reach Compliance Code
not_compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
0.7 ns
0.7 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
Interleaved Burst Length
2,4,8
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e0
e1
Length
16 mm
16 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
DDR1 DRAM
DDR DRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
70 °C
Operating Temperature-Min
-40 °C
Organization
32MX4
32MX4
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TBGA
TBGA
Package Equivalence Code
BGA60,9X12,40/32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE
GRID ARRAY, THIN PROFILE
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
4096
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Sequential Burst Length
2,4,8
Standby Current-Max
0.003 A
Supply Current-Max
0.355 mA
Supply Voltage-Max (Vsup)
2.7 V
2.7 V
Supply Voltage-Min (Vsup)
2.5 V
2.3 V
Supply Voltage-Nom (Vsup)
2.6 V
2.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
COMMERCIAL
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
1 mm
1 mm
Terminal Position
BOTTOM
BOTTOM
Width
9 mm
9 mm
Base Number Matches
3
1
Compare MT46V32M4FJ-5BIT with alternatives
Compare MT46V32M4FJ-75ES:D with alternatives