MT46H8M16LFBF-6:K
vs
W947D6HBHX5E
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Not Recommended
Ihs Manufacturer
MICRON TECHNOLOGY INC
WINBOND ELECTRONICS CORP
Part Package Code
BGA
BGA
Package Description
VFBGA, BGA60,9X10,32
8 X 9 MM, 0.80 MM PITCH, HALOGEN FREE AND LEAD FREE, VFBGA-60
Pin Count
60
60
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.02
8542.32.00.02
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
5 ns
5 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
166 MHz
200 MHz
I/O Type
COMMON
COMMON
Interleaved Burst Length
2,4,8,16
2,4,8,16
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e1
Length
9 mm
9 mm
Memory Density
134217728 bit
134217728 bit
Memory IC Type
DDR1 DRAM
LPDDR1 DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
8388608 words
8388608 words
Number of Words Code
8000000
8000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-25 °C
Organization
8MX16
8MX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TFBGA
Package Equivalence Code
BGA60,9X10,32
BGA60,9X10,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
4096
4096
Seated Height-Max
1 mm
1.025 mm
Self Refresh
YES
YES
Sequential Burst Length
2,4,8,16
2,4,8,16
Standby Current-Max
0.00001 A
0.00001 A
Supply Current-Max
0.09 mA
0.075 mA
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
OTHER
Terminal Finish
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
1
1
Samacsys Manufacturer
Winbond
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MT46H8M16LFBF-6:K with alternatives
Compare W947D6HBHX5E with alternatives