MT46H64M32LFCX-5AT:B
vs
MT46H64M32LFCX-6IT:B
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
VFBGA,
VFBGA,
Pin Count
90
90
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
FOUR BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
5 ns
5 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B90
R-PBGA-B90
JESD-609 Code
e1
e1
Length
13 mm
13 mm
Memory Density
2147483648 bit
2147483648 bit
Memory IC Type
DDR DRAM
DDR DRAM
Memory Width
32
32
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
90
90
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
105 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64MX32
64MX32
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Seated Height-Max
1 mm
1 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
9 mm
9 mm
Base Number Matches
1
2
Pbfree Code
Rohs Code
Category CO2 Kg
12
Compliance Temperature Grade
Industrial: -40C to +85C
EU RoHS Version
RoHS 2 (2011/65/EU)
Candidate List Date
2018-06-27
Conflict Mineral Status
DRC Conflict Free Undeterminable
Conflict Mineral Status Source
CMRT V3.02
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare MT46H64M32LFCX-5AT:B with alternatives
Compare MT46H64M32LFCX-6IT:B with alternatives