MT46H64M16LFCK-5IT:A
vs
MT47H64M16HV-25EL:G
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
VFBGA, BGA60,9X10,32
TFBGA,
Pin Count
60
60
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.32
8542.32.00.32
Access Mode
FOUR BANK PAGE BURST
MULTI BANK PAGE BURST
Access Time-Max
5 ns
0.35 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
200 MHz
I/O Type
COMMON
Interleaved Burst Length
2,4,8,16
JESD-30 Code
R-PBGA-B60
R-PBGA-B60
JESD-609 Code
e1
e0
Length
11.5 mm
11.5 mm
Memory Density
1073741824 bit
1073741824 bit
Memory IC Type
DDR1 DRAM
DDR2 DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
60
60
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-40 °C
Organization
64MX16
64MX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TFBGA
Package Equivalence Code
BGA60,9X10,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Refresh Cycles
8192
Seated Height-Max
1 mm
1.2 mm
Self Refresh
YES
YES
Sequential Burst Length
2,4,8,16
Standby Current-Max
0.00001 A
Supply Current-Max
0.13 mA
Supply Voltage-Max (Vsup)
1.95 V
1.9 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn/Ag/Cu)
TIN LEAD SILVER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
10 mm
8 mm
Base Number Matches
1
1
Pbfree Code
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