MT45W4MW16BFB856WT vs MT45W4MW16BKGB-701LWT feature comparison

MT45W4MW16BFB856WT Micron Technology Inc

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MT45W4MW16BKGB-701LWT Micron Technology Inc

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Rohs Code No Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description VFBGA, VFBGA,
Pin Count 54 54
Reach Compliance Code unknown compliant
Access Time-Max 85 ns 70 ns
JESD-30 Code R-PBGA-B54 R-PBGA-B54
JESD-609 Code e0 e1
Length 8 mm 8 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type PSEUDO STATIC RAM PSEUDO STATIC RAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 54 54
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -30 °C -30 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Peak Reflow Temperature (Cel) 235
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN LEAD SILVER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 6 mm 6 mm
Base Number Matches 1 1
ECCN Code 3A991.B.2.A
HTS Code 8542.32.00.41
Additional Feature SYNCHRONOUS BURST MODE POSSIBLE

Compare MT45W4MW16BFB856WT with alternatives

Compare MT45W4MW16BKGB-701LWT with alternatives