MT45W4MW16BBB-851IT
vs
MT45W4MW16BBB-858WT
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
VFBGA, BGA54,6X9,30
VFBGA, BGA54,6X9,30
Pin Count
54
54
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
85 ns
85 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B54
R-PBGA-B54
JESD-609 Code
e1
e1
Length
8 mm
8 mm
Memory Density
67108864 bit
67108864 bit
Memory IC Type
PSEUDO STATIC RAM
PSEUDO STATIC RAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
54
54
Number of Words
4194304 words
4194304 words
Number of Words Code
4000000
4000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-30 °C
Organization
4MX16
4MX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA54,6X9,30
BGA54,6X9,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1 mm
Standby Current-Max
0.00012 A
0.00012 A
Supply Current-Max
0.035 mA
0.035 mA
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Width
6 mm
6 mm
Base Number Matches
1
1
Additional Feature
SYNCHRONOUS BURST MODE POSSIBLE
Compare MT45W4MW16BBB-851IT with alternatives
Compare MT45W4MW16BBB-858WT with alternatives