MT45W2MW16BAFB-708IT
vs
MT45W2MW16BABB-706WT
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
6 X 8 MM, 1 MM HEIGHT, 0.75 MM PITCH, VFBGA-54
VFBGA, BGA54,6X9,30
Pin Count
54
54
Reach Compliance Code
not_compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
70 ns
70 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B54
R-PBGA-B54
JESD-609 Code
e0
e1
Length
8 mm
8 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
PSEUDO STATIC RAM
PSEUDO STATIC RAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
54
54
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-40 °C
-30 °C
Organization
2MX16
2MX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
VFBGA
Package Equivalence Code
BGA54,6X9,30
BGA54,6X9,30
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial
PARALLEL
PARALLEL
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1 mm
Standby Current-Max
0.00011 A
0.00011 A
Supply Current-Max
0.035 mA
0.03 mA
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
INDUSTRIAL
OTHER
Terminal Finish
TIN LEAD
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.75 mm
0.75 mm
Terminal Position
BOTTOM
BOTTOM
Width
6 mm
6 mm
Base Number Matches
1
1
Peak Reflow Temperature (Cel)
260
Compare MT45W2MW16BAFB-708IT with alternatives
Compare MT45W2MW16BABB-706WT with alternatives