MT45W2ML16PABA-85WT
vs
IS66WVE2M16ALL-70TLI
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
INTEGRATED SILICON SOLUTION INC
Part Package Code
BGA
TSOP1
Package Description
VFBGA, BGA48,6X8,30
TSOP1, TSSOP48,.8,20
Pin Count
48
48
Reach Compliance Code
compliant
compliant
ECCN Code
3A991.B.2.A
3A991.B.2.A
HTS Code
8542.32.00.41
8542.32.00.41
Access Time-Max
85 ns
70 ns
I/O Type
COMMON
COMMON
JESD-30 Code
R-PBGA-B48
R-PDSO-G48
JESD-609 Code
e8
e3
Length
8 mm
18.4 mm
Memory Density
33554432 bit
33554432 bit
Memory IC Type
PSEUDO STATIC RAM
PSEUDO STATIC RAM
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
2097152 words
2097152 words
Number of Words Code
2000000
2000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
85 °C
85 °C
Operating Temperature-Min
-25 °C
-40 °C
Organization
2MX16
2MX16
Output Characteristics
3-STATE
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
VFBGA
TSOP1
Package Equivalence Code
BGA48,6X8,30
TSSOP48,.8,20
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, VERY THIN PROFILE, FINE PITCH
SMALL OUTLINE, THIN PROFILE
Parallel/Serial
PARALLEL
PARALLEL
Peak Reflow Temperature (Cel)
260
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1 mm
1.2 mm
Standby Current-Max
0.00011 A
0.00001 A
Supply Current-Max
0.02 mA
0.03 mA
Supply Voltage-Max (Vsup)
1.95 V
1.95 V
Supply Voltage-Min (Vsup)
1.7 V
1.7 V
Supply Voltage-Nom (Vsup)
1.8 V
1.8 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
INDUSTRIAL
Terminal Finish
Tin/Silver/Copper (Sn98.5Ag1.0Cu0.5)
MATTE TIN
Terminal Form
BALL
GULL WING
Terminal Pitch
0.75 mm
0.5 mm
Terminal Position
BOTTOM
DUAL
Time@Peak Reflow Temperature-Max (s)
30
Width
6 mm
12 mm
Base Number Matches
1
1
Compare MT45W2ML16PABA-85WT with alternatives
Compare IS66WVE2M16ALL-70TLI with alternatives