MT45W2ML16BBB-606WT vs MT45W2ML16BFB-606IT feature comparison

MT45W2ML16BBB-606WT Micron Technology Inc

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MT45W2ML16BFB-606IT Micron Technology Inc

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Pbfree Code Yes No
Rohs Code Yes No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description VFBGA, VFBGA,
Pin Count 54 54
Reach Compliance Code compliant compliant
ECCN Code 3A991.B.2.A 3A991.B.2.A
HTS Code 8542.32.00.41 8542.32.00.41
Category CO2 Kg 12 12
Compliance Temperature Grade Commercial Extended: -25C to +85C Industrial: -40C to +85C
EU RoHS Version RoHS 2 (2011/65/EU)
Candidate List Date 2017-01-12 2017-01-12
Conflict Mineral Status DRC Conflict Free DRC Conflict Free
Conflict Mineral Status Source CMRT V4.20 CMRT V4.20
Access Time-Max 60 ns 60 ns
JESD-30 Code R-PBGA-B54 R-PBGA-B54
JESD-609 Code e1 e0
Length 8 mm 8 mm
Memory Density 33554432 bit 33554432 bit
Memory IC Type PSEUDO STATIC RAM PSEUDO STATIC RAM
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 54 54
Number of Words 2097152 words 2097152 words
Number of Words Code 2000000 2000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -40 °C
Organization 2MX16 2MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code VFBGA VFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Parallel/Serial PARALLEL PARALLEL
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1 mm 1 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V 1.8 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish TIN SILVER COPPER TIN LEAD SILVER
Terminal Form BALL BALL
Terminal Pitch 0.75 mm 0.75 mm
Terminal Position BOTTOM BOTTOM
Width 6 mm 6 mm
Base Number Matches 1 1

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