MT41K256M16RE-15EIT:D
vs
MT41K256M16HA-15EIT:E
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Package Description
TFBGA, BGA96,9X16,32
9 X 14 MM, LEAD FREE, FBGA-96
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
Clock Frequency-Max (fCLK)
667 MHz
I/O Type
COMMON
Interleaved Burst Length
8
JESD-30 Code
R-PBGA-B96
R-PBGA-B96
Length
14 mm
14 mm
Memory Density
4294967296 bit
4294967296 bit
Memory IC Type
DDR3L DRAM
DDR DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
96
96
Number of Words
268435456 words
268435456 words
Number of Words Code
256000000
256000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
95 °C
Operating Temperature-Min
Organization
256MX16
256MX16
Output Characteristics
3-STATE
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Equivalence Code
BGA96,9X16,32
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Refresh Cycles
8192
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Sequential Burst Length
8
Standby Current-Max
0.02 A
Supply Current-Max
0.285 mA
Supply Voltage-Max (Vsup)
1.45 V
1.45 V
Supply Voltage-Min (Vsup)
1.283 V
1.283 V
Supply Voltage-Nom (Vsup)
1.35 V
1.35 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
OTHER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
10 mm
9 mm
Base Number Matches
1
1
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