MT41K256M16HA-15E:E
vs
H5TC4G63MFR-H9I
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
SK HYNIX INC
Package Description
9 X 14 MM, LEAD FREE, FBGA-96
TFBGA, BGA96,9X16,32
Reach Compliance Code
unknown
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B96
R-PBGA-B96
Length
14 mm
13 mm
Memory Density
4294967296 bit
4294967296 bit
Memory IC Type
DDR DRAM
DDR3L DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
96
96
Number of Words
268435456 words
268435456 words
Number of Words Code
256000000
256000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
256MX16
256MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.45 V
1.45 V
Supply Voltage-Min (Vsup)
1.283 V
1.283 V
Supply Voltage-Nom (Vsup)
1.35 V
1.35 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
9 mm
9.4 mm
Base Number Matches
1
1
Rohs Code
Part Package Code
BGA
Pin Count
96
Access Time-Max
0.255 ns
Clock Frequency-Max (fCLK)
667 MHz
I/O Type
COMMON
Interleaved Burst Length
4,8
Operating Temperature-Max
85 °C
Operating Temperature-Min
-45 °C
Output Characteristics
3-STATE
Package Equivalence Code
BGA96,9X16,32
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Qualification Status
Not Qualified
Refresh Cycles
8192
Sequential Burst Length
4,8
Standby Current-Max
0.02 A
Supply Current-Max
0.24 mA
Temperature Grade
INDUSTRIAL
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MT41K256M16HA-15E:E with alternatives
Compare H5TC4G63MFR-H9I with alternatives