MT41K128M16JT-187E:K
vs
MT41J128M16HA-125AAT:D
feature comparison
All Stats
Differences Only
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
TFBGA,
Pin Count
96
96
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B96
R-PBGA-B96
JESD-609 Code
e1
e1
Length
14 mm
14 mm
Memory Density
2147483648 bit
2147483648 bit
Memory IC Type
DDR3L DRAM
DDR3 DRAM
Memory Width
16
16
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
96
96
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
128MX16
128MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel)
260
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.45 V
1.575 V
Supply Voltage-Min (Vsup)
1.283 V
1.425 V
Supply Voltage-Nom (Vsup)
1.35 V
1.5 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN SILVER COPPER
TIN SILVER COPPER
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Time@Peak Reflow Temperature-Max (s)
30
Width
8 mm
9 mm
Base Number Matches
1
1
Pbfree Code
Rohs Code
Operating Temperature-Max
85 °C
Operating Temperature-Min
-40 °C
Temperature Grade
INDUSTRIAL
Compare MT41K128M16JT-187E:K with alternatives
Compare MT41J128M16HA-125AAT:D with alternatives