MT41J512M8RH-125:E vs MT41J512M8RH-125IT:J feature comparison

MT41J512M8RH-125:E Micron Technology Inc

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MT41J512M8RH-125IT:J Micron Technology Inc

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Rohs Code Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Package Description TFBGA, FBGA-78
Reach Compliance Code compliant unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Samacsys Manufacturer Micron
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B78 R-PBGA-B78
JESD-609 Code e1
Length 10.5 mm 10.5 mm
Memory Density 4294967296 bit 4294967296 bit
Memory IC Type DDR DRAM DDR DRAM
Memory Width 8 8
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 78 78
Number of Words 536870912 words 536870912 words
Number of Words Code 512000000 512000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C
Organization 512MX8 512MX8
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.575 V 1.575 V
Supply Voltage-Min (Vsup) 1.425 V 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER INDUSTRIAL
Terminal Finish Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 9 mm 9 mm
Base Number Matches 1 1

Compare MT41J512M8RH-125:E with alternatives

Compare MT41J512M8RH-125IT:J with alternatives