MT41J512M14DA-15EIT:H
vs
MT41K256M4JP-15E:F
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
BGA
BGA
Package Description
TFBGA,
TFBGA,
Pin Count
78
78
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.32
Access Mode
MULTI BANK PAGE BURST
MULTI BANK PAGE BURST
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-PBGA-B78
R-PBGA-B78
JESD-609 Code
e1
e1
Length
10.5 mm
11.5 mm
Memory Density
2147483648 bit
1073741824 bit
Memory IC Type
DDR3 DRAM
DDR DRAM
Memory Width
4
4
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
78
78
Number of Words
536870912 words
268435456 words
Number of Words Code
512000000
256000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Organization
512MX4
256MX4
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TFBGA
TFBGA
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
GRID ARRAY, THIN PROFILE, FINE PITCH
GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
1.575 V
1.45 V
Supply Voltage-Min (Vsup)
1.425 V
1.283 V
Supply Voltage-Nom (Vsup)
1.5 V
1.35 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Terminal Finish
TIN SILVER COPPER
Tin/Silver/Copper (Sn/Ag/Cu)
Terminal Form
BALL
BALL
Terminal Pitch
0.8 mm
0.8 mm
Terminal Position
BOTTOM
BOTTOM
Width
8 mm
8 mm
Base Number Matches
1
1
Samacsys Manufacturer
Micron
Peak Reflow Temperature (Cel)
260
Time@Peak Reflow Temperature-Max (s)
30
Compare MT41J512M14DA-15EIT:H with alternatives
Compare MT41K256M4JP-15E:F with alternatives