MT41J1G4THU25:A vs MT41J512M4JE-187EIT:A feature comparison

MT41J1G4THU25:A Micron Technology Inc

Buy Now Datasheet

MT41J512M4JE-187EIT:A Micron Technology Inc

Buy Now Datasheet
Rohs Code Yes Yes
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LFBGA, TFBGA,
Pin Count 82 82
Reach Compliance Code compliant unknown
Access Mode DUAL BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B82 R-PBGA-B82
JESD-609 Code e1 e1
Length 15 mm 15 mm
Memory Density 2147483648 bit 268435456 bit
Memory IC Type DDR DRAM DDR3 DRAM
Memory Width 4 4
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 82 82
Number of Words 536870912 words 67108864 words
Number of Words Code 512000000 64000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 85 °C
Operating Temperature-Min
Organization 512MX4 64MX4
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Peak Reflow Temperature (Cel) 260
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.35 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.575 V 1.575 V
Supply Voltage-Min (Vsup) 1.425 V 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER
Terminal Finish TIN SILVER COPPER TIN SILVER COPPER
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Time@Peak Reflow Temperature-Max (s) 30
Width 12.5 mm 12.5 mm
Base Number Matches 1 1
ECCN Code EAR99
HTS Code 8542.32.00.24
Self Refresh YES

Compare MT41J1G4THU25:A with alternatives

Compare MT41J512M4JE-187EIT:A with alternatives