MT41J128M16HA-107G:D vs H5TQ2G63FFR-RDI feature comparison

MT41J128M16HA-107G:D Micron Technology Inc

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H5TQ2G63FFR-RDI SK Hynix Inc

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Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC SK HYNIX INC
Package Description TFBGA, TFBGA, BGA96,9X16,32
Reach Compliance Code unknown compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Samacsys Manufacturer Micron
Access Mode MULTI BANK PAGE BURST MULTI BANK PAGE BURST
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-PBGA-B96 R-PBGA-B96
Length 14 mm 13 mm
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type DDR DRAM DDR3 DRAM
Memory Width 16 16
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 96 96
Number of Words 134217728 words 134217728 words
Number of Words Code 128000000 128000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Organization 128MX16 128MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, THIN PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Seated Height-Max 1.2 mm 1.2 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 1.575 V 1.575 V
Supply Voltage-Min (Vsup) 1.425 V 1.425 V
Supply Voltage-Nom (Vsup) 1.5 V 1.5 V
Surface Mount YES YES
Technology CMOS CMOS
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 9 mm 7.5 mm
Base Number Matches 1 1
Rohs Code Yes
Part Package Code BGA
Pin Count 96
Access Time-Max 0.195 ns
Clock Frequency-Max (fCLK) 933 MHz
I/O Type COMMON
Interleaved Burst Length 4,8
Operating Temperature-Max 85 °C
Operating Temperature-Min -40 °C
Output Characteristics 3-STATE
Package Equivalence Code BGA96,9X16,32
Peak Reflow Temperature (Cel) NOT SPECIFIED
Qualification Status Not Qualified
Refresh Cycles 8192
Sequential Burst Length 4,8
Standby Current-Max 0.012 A
Supply Current-Max 0.22 mA
Temperature Grade INDUSTRIAL
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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