MT29F64G08AJABAH1-IT:B
vs
MT29F64G08AJABAH3-IT:B
feature comparison
Rohs Code |
Yes
|
Yes
|
Part Life Cycle Code |
Active
|
Active
|
Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
Package Description |
VBGA,
|
LBGA,
|
Reach Compliance Code |
compliant
|
compliant
|
ECCN Code |
EAR99
|
EAR99
|
HTS Code |
8542.32.00.51
|
8542.32.00.51
|
JESD-30 Code |
R-PBGA-B100
|
R-PBGA-B100
|
JESD-609 Code |
e1
|
e1
|
Length |
18 mm
|
18 mm
|
Memory Density |
68719476736 bit
|
68719476736 bit
|
Memory IC Type |
FLASH
|
FLASH
|
Memory Width |
8
|
8
|
Number of Functions |
1
|
1
|
Number of Terminals |
100
|
100
|
Number of Words |
8589934592 words
|
8589934592 words
|
Number of Words Code |
8000000000
|
8000000000
|
Operating Mode |
ASYNCHRONOUS
|
ASYNCHRONOUS
|
Operating Temperature-Max |
85 °C
|
85 °C
|
Operating Temperature-Min |
-40 °C
|
-40 °C
|
Organization |
8GX8
|
8GX8
|
Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
Package Code |
VBGA
|
LBGA
|
Package Shape |
RECTANGULAR
|
RECTANGULAR
|
Package Style |
GRID ARRAY, VERY THIN PROFILE
|
GRID ARRAY, LOW PROFILE
|
Parallel/Serial |
PARALLEL
|
PARALLEL
|
Programming Voltage |
2.7 V
|
2.7 V
|
Seated Height-Max |
1 mm
|
1.4 mm
|
Supply Voltage-Max (Vsup) |
3.6 V
|
3.6 V
|
Supply Voltage-Min (Vsup) |
2.7 V
|
2.7 V
|
Supply Voltage-Nom (Vsup) |
3.3 V
|
3.3 V
|
Surface Mount |
YES
|
YES
|
Technology |
CMOS
|
CMOS
|
Temperature Grade |
INDUSTRIAL
|
INDUSTRIAL
|
Terminal Finish |
TIN SILVER COPPER
|
TIN SILVER COPPER
|
Terminal Form |
BALL
|
BALL
|
Terminal Pitch |
1 mm
|
1 mm
|
Terminal Position |
BOTTOM
|
BOTTOM
|
Type |
SLC NAND TYPE
|
SLC NAND TYPE
|
Width |
12 mm
|
12 mm
|
Base Number Matches |
1
|
1
|
|
|
|
Compare MT29F64G08AJABAH1-IT:B with alternatives
Compare MT29F64G08AJABAH3-IT:B with alternatives