MT29F2G16FABWPXXXX
vs
NAND02GW4B2BN6T
feature comparison
All Stats
Differences Only
Pbfree Code
Rohs Code
Part Life Cycle Code
Active
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICRON TECHNOLOGY INC
Part Package Code
TSOP1
TSOP
Package Description
LEAD FREE, TSOP1-48
TSSOP,
Pin Count
48
48
Reach Compliance Code
compliant
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.51
8542.32.00.51
JESD-30 Code
R-PDSO-G48
R-PDSO-G48
JESD-609 Code
e3
Length
18.4 mm
18.4 mm
Memory Density
2147483648 bit
2147483648 bit
Memory IC Type
FLASH
FLASH
Memory Width
16
16
Number of Functions
1
1
Number of Terminals
48
48
Number of Words
134217728 words
134217728 words
Number of Words Code
128000000
128000000
Operating Mode
ASYNCHRONOUS
ASYNCHRONOUS
Operating Temperature-Max
70 °C
85 °C
Operating Temperature-Min
-40 °C
Organization
128MX16
128MX16
Package Body Material
PLASTIC/EPOXY
PLASTIC/EPOXY
Package Code
TSOP1
TSSOP
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
SMALL OUTLINE, THIN PROFILE
SMALL OUTLINE, THIN PROFILE, SHRINK PITCH
Parallel/Serial
PARALLEL
PARALLEL
Programming Voltage
2.7 V
3 V
Qualification Status
Not Qualified
Seated Height-Max
1.2 mm
1.2 mm
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
2.7 V
2.7 V
Supply Voltage-Nom (Vsup)
3 V
3 V
Surface Mount
YES
YES
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
INDUSTRIAL
Terminal Finish
MATTE TIN
Terminal Form
GULL WING
GULL WING
Terminal Pitch
0.5 mm
0.5 mm
Terminal Position
DUAL
DUAL
Type
SLC NAND TYPE
NAND TYPE
Width
12 mm
12 mm
Base Number Matches
1
3
Access Time-Max
35 ns
Supply Current-Max
0.03 mA
Compare MT29F2G16FABWPXXXX with alternatives
Compare NAND02GW4B2BN6T with alternatives