MT29F2G08ABBEAHC:E vs MT29F2G08ABBGAH4-IT:G feature comparison

MT29F2G08ABBEAHC:E Micron Technology Inc

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MT29F2G08ABBGAH4-IT:G Micron Technology Inc

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Rohs Code Yes Yes
Part Life Cycle Code Obsolete Active
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Package Description 10.50 X 13 MM, 1 MM HEIGHT, VFBGA-63
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.51 8542.32.00.51
Access Time-Max 25 ns
Command User Interface YES
Data Polling NO
JESD-30 Code R-PBGA-B63
Length 13 mm
Memory Density 2147483648 bit
Memory IC Type FLASH FLASH
Memory Width 8
Number of Functions 1
Number of Sectors/Size 2K
Number of Terminals 63
Number of Words 268435456 words
Number of Words Code 256000000
Operating Mode ASYNCHRONOUS
Operating Temperature-Max 70 °C
Operating Temperature-Min
Organization 256MX8
Package Body Material PLASTIC/EPOXY
Package Code VFBGA
Package Equivalence Code BGA63,10X12,32
Package Shape RECTANGULAR
Package Style GRID ARRAY, VERY THIN PROFILE, FINE PITCH
Page Size 2K words
Parallel/Serial PARALLEL
Programming Voltage 1.8 V 1.8 V
Qualification Status Not Qualified
Ready/Busy YES
Seated Height-Max 1 mm
Sector Size 128K
Standby Current-Max 0.00005 A
Supply Current-Max 0.02 mA
Supply Voltage-Max (Vsup) 1.95 V
Supply Voltage-Min (Vsup) 1.7 V
Supply Voltage-Nom (Vsup) 1.8 V
Surface Mount YES
Technology CMOS
Temperature Grade COMMERCIAL
Terminal Form BALL
Terminal Pitch 0.8 mm
Terminal Position BOTTOM
Toggle Bit NO
Type SLC NAND TYPE SLC NAND TYPE
Width 10.5 mm
Base Number Matches 1 1
Factory Lead Time 18 Weeks, 1 Day
Samacsys Manufacturer Micron
Peak Reflow Temperature (Cel) NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s) NOT SPECIFIED

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Compare MT29F2G08ABBGAH4-IT:G with alternatives