MT29F128G08AKCABH2-10ITZ:A
vs
MT29F128G08AKCABH2-10:A
feature comparison
| Rohs Code |
Yes
|
Yes
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
MICRON TECHNOLOGY INC
|
| Package Description |
BGA, BGA100,10X17,40
|
|
| Reach Compliance Code |
compliant
|
compliant
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.51
|
8542.32.00.51
|
| Samacsys Manufacturer |
Micron
|
|
| Access Time-Max |
20 ns
|
20 ns
|
| Command User Interface |
YES
|
YES
|
| Data Polling |
NO
|
NO
|
| JESD-30 Code |
R-PBGA-B100
|
R-PBGA-B100
|
| Memory Density |
137438953472 bit
|
137438953472 bit
|
| Memory IC Type |
FLASH
|
FLASH
|
| Memory Width |
8
|
8
|
| Number of Sectors/Size |
16K
|
16K
|
| Number of Terminals |
100
|
100
|
| Number of Words |
17179869184 words
|
17179869184 words
|
| Number of Words Code |
16000000000
|
16000000000
|
| Operating Temperature-Max |
85 °C
|
70 °C
|
| Operating Temperature-Min |
-40 °C
|
|
| Organization |
16GX8
|
16GX8
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
BGA
|
BGA
|
| Package Equivalence Code |
BGA100,10X17,40
|
BGA100,10X17,40
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY
|
GRID ARRAY
|
| Page Size |
8K words
|
8K words
|
| Parallel/Serial |
PARALLEL
|
PARALLEL
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Ready/Busy |
YES
|
YES
|
| Sector Size |
1M
|
1M
|
| Standby Current-Max |
0.00001 A
|
0.00001 A
|
| Supply Current-Max |
0.05 mA
|
0.05 mA
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
INDUSTRIAL
|
COMMERCIAL
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
1 mm
|
1 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Toggle Bit |
NO
|
NO
|
| Type |
SLC NAND TYPE
|
SLC NAND TYPE
|
| Base Number Matches |
2
|
1
|
|
|
|
Compare MT29F128G08AKCABH2-10ITZ:A with alternatives
Compare MT29F128G08AKCABH2-10:A with alternatives