MT28C256564W18SFT-F706P70BBWT
vs
PF38F3040L0YBQ0A
feature comparison
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
INTEL CORP
|
| Part Package Code |
BGA
|
BGA
|
| Package Description |
LFBGA,
|
TFBGA,
|
| Pin Count |
88
|
88
|
| Reach Compliance Code |
unknown
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.71
|
8542.32.00.71
|
| Additional Feature |
CELLULARRAM IS ORGANIZED AS 4M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH
|
FLASH IS ALSO ORGANIZED AS 8M X 16, PSRAM IS ORGANIZED AS 2M X 16 OR 4M X 16
|
| JESD-30 Code |
R-PBGA-B88
|
R-PBGA-B88
|
| JESD-609 Code |
e1
|
|
| Length |
12 mm
|
10 mm
|
| Memory Density |
134217728 bit
|
268435456 bit
|
| Memory IC Type |
MEMORY CIRCUIT
|
MEMORY CIRCUIT
|
| Memory Width |
16
|
16
|
| Number of Functions |
1
|
1
|
| Number of Terminals |
88
|
88
|
| Number of Words |
8388608 words
|
16777216 words
|
| Number of Words Code |
8000000
|
16000000
|
| Operating Mode |
ASYNCHRONOUS
|
SYNCHRONOUS
|
| Operating Temperature-Max |
85 °C
|
|
| Operating Temperature-Min |
-25 °C
|
|
| Organization |
8MX16
|
16MX16
|
| Package Body Material |
PLASTIC/EPOXY
|
PLASTIC/EPOXY
|
| Package Code |
LFBGA
|
TFBGA
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
GRID ARRAY, LOW PROFILE, FINE PITCH
|
GRID ARRAY, THIN PROFILE, FINE PITCH
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Seated Height-Max |
1.4 mm
|
1.2 mm
|
| Supply Voltage-Max (Vsup) |
1.95 V
|
1.95 V
|
| Supply Voltage-Min (Vsup) |
1.7 V
|
1.7 V
|
| Surface Mount |
YES
|
YES
|
| Technology |
CMOS
|
CMOS
|
| Temperature Grade |
OTHER
|
|
| Terminal Finish |
TIN SILVER COPPER
|
|
| Terminal Form |
BALL
|
BALL
|
| Terminal Pitch |
0.8 mm
|
0.8 mm
|
| Terminal Position |
BOTTOM
|
BOTTOM
|
| Width |
9 mm
|
8 mm
|
| Base Number Matches |
1
|
1
|
| Supply Voltage-Nom (Vsup) |
|
1.8 V
|
|
|
|
Compare MT28C256564W18SFT-F706P70BBWT with alternatives
Compare PF38F3040L0YBQ0A with alternatives