MT28C256564W18SFT-F706P70BBWT vs M36L0T7050T0ZAQ feature comparison

MT28C256564W18SFT-F706P70BBWT Micron Technology Inc

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M36L0T7050T0ZAQ STMicroelectronics

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Part Life Cycle Code Obsolete Transferred
Ihs Manufacturer MICRON TECHNOLOGY INC STMICROELECTRONICS
Part Package Code BGA BGA
Package Description LFBGA, 8 X 10 MM, 0.80 MM PITCH, TFBGA-88
Pin Count 88 88
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature CELLULARRAM IS ORGANIZED AS 4M X 16; CONTAINS ADDITIONAL 8M X 16 FLASH PSRAM IS ORGANIZED AS 2M X 16
JESD-30 Code R-PBGA-B88 R-PBGA-B88
JESD-609 Code e1 e0
Length 12 mm 10 mm
Memory Density 134217728 bit 134217728 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 88 88
Number of Words 8388608 words 8388608 words
Number of Words Code 8000000 8000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 8MX16 8MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 9 mm 8 mm
Base Number Matches 1 2
Rohs Code No
Access Time-Max 90 ns
Mixed Memory Type FLASH+PSRAM
Package Equivalence Code BGA88,8X12,32
Standby Current-Max 0.000005 A
Supply Current-Max 0.03 mA

Compare MT28C256564W18SFT-F706P70BBWT with alternatives

Compare M36L0T7050T0ZAQ with alternatives