MT28C128532W18DFW-F705P85KBBWT vs MT28C64416W30AFW-F70P70KBWT feature comparison

MT28C128532W18DFW-F705P85KBBWT Micron Technology Inc

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MT28C64416W30AFW-F70P70KBWT Micron Technology Inc

Buy Now Datasheet
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC MICRON TECHNOLOGY INC
Part Package Code BGA BGA
Package Description LFBGA, 8 X 10 MM, FBGA-77
Pin Count 77 77
Reach Compliance Code unknown not_compliant
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.71 8542.32.00.71
Additional Feature CELLULARRAM IS ORGANIZED AS 2M X 16; CONTAINS ADDITIONAL 4M X 16 FLASH CELLULAR RAM IS ORGANIZED AS 1M X 16
JESD-30 Code R-PBGA-B77 R-PBGA-B77
JESD-609 Code e1 e0
Length 10 mm 10 mm
Memory Density 67108864 bit 67108864 bit
Memory IC Type MEMORY CIRCUIT MEMORY CIRCUIT
Memory Width 16 16
Number of Functions 1 1
Number of Terminals 77 77
Number of Words 4194304 words 4194304 words
Number of Words Code 4000000 4000000
Operating Mode ASYNCHRONOUS ASYNCHRONOUS
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -25 °C -25 °C
Organization 4MX16 4MX16
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code LFBGA TFBGA
Package Shape RECTANGULAR RECTANGULAR
Package Style GRID ARRAY, LOW PROFILE, FINE PITCH GRID ARRAY, THIN PROFILE, FINE PITCH
Qualification Status Not Qualified Not Qualified
Seated Height-Max 1.4 mm 1.2 mm
Supply Voltage-Max (Vsup) 1.95 V 1.95 V
Supply Voltage-Min (Vsup) 1.7 V 1.7 V
Surface Mount YES YES
Technology CMOS CMOS
Temperature Grade OTHER OTHER
Terminal Finish TIN SILVER COPPER TIN LEAD
Terminal Form BALL BALL
Terminal Pitch 0.8 mm 0.8 mm
Terminal Position BOTTOM BOTTOM
Width 8 mm 8 mm
Base Number Matches 1 1
Pbfree Code No
Rohs Code No
Access Time-Max 70 ns
Mixed Memory Type FLASH+SRAM
Package Equivalence Code BGA77,8X10,32
Standby Current-Max 0.000115 A

Compare MT28C128532W18DFW-F705P85KBBWT with alternatives

Compare MT28C64416W30AFW-F70P70KBWT with alternatives