MT16LSDF6464HY-133D2
vs
WED3DG6464V10D1
feature comparison
All Stats
Differences Only
Rohs Code
Part Life Cycle Code
Obsolete
Transferred
Ihs Manufacturer
MICRON TECHNOLOGY INC
MICROSEMI CORP
Part Package Code
SODIMM
MODULE
Package Description
DIMM,
DIMM,
Pin Count
144
144
Reach Compliance Code
compliant
compliant
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
DUAL BANK PAGE BURST
FOUR BANK PAGE BURST
Access Time-Max
5.4 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-XZMA-N144
R-XDMA-N144
JESD-609 Code
e4
Length
67.585 mm
Memory Density
4294967296 bit
4294967296 bit
Memory IC Type
SYNCHRONOUS DRAM MODULE
SYNCHRONOUS DRAM MODULE
Memory Width
64
64
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
67108864 words
67108864 words
Number of Words Code
64000000
64000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
65 °C
70 °C
Operating Temperature-Min
Organization
64MX64
64MX64
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.8 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
GOLD
Terminal Form
NO LEAD
NO LEAD
Terminal Position
ZIG-ZAG
DUAL
Width
31.75 mm
Base Number Matches
1
2
Pbfree Code
Peak Reflow Temperature (Cel)
NOT SPECIFIED
Time@Peak Reflow Temperature-Max (s)
NOT SPECIFIED
Compare MT16LSDF6464HY-133D2 with alternatives
Compare WED3DG6464V10D1 with alternatives