MT16LSDF3264HG-10EXX vs THLY25N01C75 feature comparison

MT16LSDF3264HG-10EXX Micron Technology Inc

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THLY25N01C75 Toshiba America Electronic Components

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Rohs Code No
Part Life Cycle Code Obsolete Obsolete
Ihs Manufacturer MICRON TECHNOLOGY INC TOSHIBA CORP
Part Package Code SODIMM DIMM
Package Description DIMM, DIMM, DIMM144,32
Pin Count 144 144
Reach Compliance Code unknown unknown
ECCN Code EAR99 EAR99
HTS Code 8542.32.00.36 8542.32.00.36
Access Mode DUAL BANK PAGE BURST DUAL BANK PAGE BURST
Access Time-Max 6 ns 5.4 ns
Additional Feature AUTO/SELF REFRESH AUTO/SELF REFRESH
JESD-30 Code R-XZMA-N144 R-XDMA-N144
JESD-609 Code e0
Length 67.585 mm
Memory Density 2147483648 bit 2147483648 bit
Memory IC Type SYNCHRONOUS DRAM MODULE SYNCHRONOUS DRAM MODULE
Memory Width 64 64
Number of Functions 1 1
Number of Ports 1 1
Number of Terminals 144 144
Number of Words 33554432 words 33554432 words
Number of Words Code 32000000 32000000
Operating Mode SYNCHRONOUS SYNCHRONOUS
Operating Temperature-Max 65 °C 70 °C
Operating Temperature-Min
Organization 32MX64 32MX64
Package Body Material UNSPECIFIED UNSPECIFIED
Package Code DIMM DIMM
Package Shape RECTANGULAR RECTANGULAR
Package Style MICROELECTRONIC ASSEMBLY MICROELECTRONIC ASSEMBLY
Qualification Status Not Qualified Not Qualified
Seated Height-Max 3.8 mm
Self Refresh YES YES
Supply Voltage-Max (Vsup) 3.6 V 3.6 V
Supply Voltage-Min (Vsup) 3 V 3 V
Supply Voltage-Nom (Vsup) 3.3 V 3.3 V
Surface Mount NO NO
Technology CMOS CMOS
Temperature Grade COMMERCIAL COMMERCIAL
Terminal Finish TIN LEAD
Terminal Form NO LEAD NO LEAD
Terminal Position ZIG-ZAG DUAL
Width 31.75 mm
Base Number Matches 1 1
Clock Frequency-Max (fCLK) 133 MHz
I/O Type COMMON
Output Characteristics 3-STATE
Package Equivalence Code DIMM144,32
Refresh Cycles 8192
Standby Current-Max 0.008 A
Supply Current-Max 1.28 mA
Terminal Pitch 0.8 mm

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