MT16LSDF3264HG-10EXX
vs
THLY25N01C75
feature comparison
All Stats
Differences Only
Rohs Code
No
Part Life Cycle Code
Obsolete
Obsolete
Ihs Manufacturer
MICRON TECHNOLOGY INC
TOSHIBA CORP
Part Package Code
SODIMM
DIMM
Package Description
DIMM,
DIMM, DIMM144,32
Pin Count
144
144
Reach Compliance Code
unknown
unknown
ECCN Code
EAR99
EAR99
HTS Code
8542.32.00.36
8542.32.00.36
Access Mode
DUAL BANK PAGE BURST
DUAL BANK PAGE BURST
Access Time-Max
6 ns
5.4 ns
Additional Feature
AUTO/SELF REFRESH
AUTO/SELF REFRESH
JESD-30 Code
R-XZMA-N144
R-XDMA-N144
JESD-609 Code
e0
Length
67.585 mm
Memory Density
2147483648 bit
2147483648 bit
Memory IC Type
SYNCHRONOUS DRAM MODULE
SYNCHRONOUS DRAM MODULE
Memory Width
64
64
Number of Functions
1
1
Number of Ports
1
1
Number of Terminals
144
144
Number of Words
33554432 words
33554432 words
Number of Words Code
32000000
32000000
Operating Mode
SYNCHRONOUS
SYNCHRONOUS
Operating Temperature-Max
65 °C
70 °C
Operating Temperature-Min
Organization
32MX64
32MX64
Package Body Material
UNSPECIFIED
UNSPECIFIED
Package Code
DIMM
DIMM
Package Shape
RECTANGULAR
RECTANGULAR
Package Style
MICROELECTRONIC ASSEMBLY
MICROELECTRONIC ASSEMBLY
Qualification Status
Not Qualified
Not Qualified
Seated Height-Max
3.8 mm
Self Refresh
YES
YES
Supply Voltage-Max (Vsup)
3.6 V
3.6 V
Supply Voltage-Min (Vsup)
3 V
3 V
Supply Voltage-Nom (Vsup)
3.3 V
3.3 V
Surface Mount
NO
NO
Technology
CMOS
CMOS
Temperature Grade
COMMERCIAL
COMMERCIAL
Terminal Finish
TIN LEAD
Terminal Form
NO LEAD
NO LEAD
Terminal Position
ZIG-ZAG
DUAL
Width
31.75 mm
Base Number Matches
1
1
Clock Frequency-Max (fCLK)
133 MHz
I/O Type
COMMON
Output Characteristics
3-STATE
Package Equivalence Code
DIMM144,32
Refresh Cycles
8192
Standby Current-Max
0.008 A
Supply Current-Max
1.28 mA
Terminal Pitch
0.8 mm
Compare MT16LSDF3264HG-10EXX with alternatives
Compare THLY25N01C75 with alternatives