MT1259CP-10
vs
MB81256-10Z
feature comparison
| Rohs Code |
No
|
|
| Part Life Cycle Code |
Obsolete
|
Obsolete
|
| Ihs Manufacturer |
MICRON TECHNOLOGY INC
|
FUJITSU SEMICONDUCTOR AMERICA INC
|
| Reach Compliance Code |
not_compliant
|
unknown
|
| ECCN Code |
EAR99
|
EAR99
|
| HTS Code |
8542.32.00.02
|
8542.32.00.02
|
| Access Time-Max |
100 ns
|
100 ns
|
| I/O Type |
SEPARATE
|
|
| JESD-30 Code |
R-XDIP-T18
|
R-GDIP-T16
|
| JESD-609 Code |
e0
|
|
| Memory Density |
262144 bit
|
262144 bit
|
| Memory IC Type |
OTHER DRAM
|
PAGE MODE DRAM
|
| Memory Width |
1
|
1
|
| Number of Terminals |
18
|
16
|
| Number of Words |
262144 words
|
262144 words
|
| Number of Words Code |
256000
|
256000
|
| Operating Temperature-Max |
70 °C
|
70 °C
|
| Operating Temperature-Min |
|
|
| Organization |
256KX1
|
256KX1
|
| Output Characteristics |
3-STATE
|
3-STATE
|
| Package Body Material |
CERAMIC
|
CERAMIC, GLASS-SEALED
|
| Package Code |
DIP
|
DIP
|
| Package Equivalence Code |
DIP18,.3
|
|
| Package Shape |
RECTANGULAR
|
RECTANGULAR
|
| Package Style |
IN-LINE
|
IN-LINE
|
| Qualification Status |
Not Qualified
|
Not Qualified
|
| Refresh Cycles |
512
|
256
|
| Surface Mount |
NO
|
NO
|
| Technology |
MOS
|
NMOS
|
| Temperature Grade |
COMMERCIAL
|
COMMERCIAL
|
| Terminal Finish |
Tin/Lead (Sn/Pb)
|
|
| Terminal Form |
THROUGH-HOLE
|
THROUGH-HOLE
|
| Terminal Pitch |
2.54 mm
|
2.54 mm
|
| Terminal Position |
DUAL
|
DUAL
|
| Base Number Matches |
1
|
1
|
| Package Description |
|
DIP,
|
| Access Mode |
|
PAGE
|
| Additional Feature |
|
RAS ONLY; CAS BEFORE RAS; HIDDEN REFRESH
|
| Length |
|
19.3 mm
|
| Number of Functions |
|
1
|
| Number of Ports |
|
1
|
| Operating Mode |
|
ASYNCHRONOUS
|
| Seated Height-Max |
|
5.08 mm
|
| Supply Voltage-Max (Vsup) |
|
5.5 V
|
| Supply Voltage-Min (Vsup) |
|
4.5 V
|
| Supply Voltage-Nom (Vsup) |
|
5 V
|
| Width |
|
7.62 mm
|
|
|
|
Compare MT1259CP-10 with alternatives
Compare MB81256-10Z with alternatives