MSP430G2333IPW20 vs MSP430G2332IN20 feature comparison

MSP430G2333IPW20 Texas Instruments

Buy Now Datasheet

MSP430G2332IN20 Texas Instruments

Buy Now Datasheet
Pbfree Code Yes Yes
Rohs Code Yes Yes
Part Life Cycle Code Active Active
parentfamilyid 4107724
Ihs Manufacturer TEXAS INSTRUMENTS INC TEXAS INSTRUMENTS INC
Part Package Code TSSOP DIP
Package Description TSSOP, TSSOP20,.25 LEAD FREE, PLASTIC, DIP-20
Pin Count 20 20
Reach Compliance Code compliant compliant
ECCN Code EAR99 EAR99
HTS Code 8542.31.00.01 8542.31.00.01
kg CO2e/kg 11.6
Average Weight (mg) 78.775
CO2e (mg) 913.79
Samacsys Description Texas Instruments MSP430G2333IPW20, 16bit MSP430 Microcontroller, 16MHz, 4 kB Flash, 20-Pin TSSOP
Samacsys Manufacturer Texas Instruments Texas Instruments
Samacsys Modified On 2023-03-07 16:10:32
Total Weight 78.461694
Category CO2 Kg 11.6
CO2 910.1556503999999
Compliance Temperature Grade Industrial: -40C to +85C
EU RoHS Version RoHS 2 (2015/863/EU)
Candidate List Date 2024-06-27
CAS Accounted for Wt 100
CA Prop 65 Presence YES
CA Prop 65 CAS Numbers 7439-92-1, 7440-02-0, 1333-86-4
EFUP e
Conflict Mineral Status DRC Conflict Free
Conflict Mineral Status Source CMRT V6.31
Has ADC YES YES
Additional Feature ALSO OPERATES AT 1.8 V MINIMUM SUPPLY AT 6 MHZ ALSO OPERATES 1.8 V MINIMUM SUPPLY AT 6 MHZ AND 2.7 V MINIMUM SUPPLY AT 12 MHZ
Address Bus Width
Bit Size 16 16
Boundary Scan YES YES
CPU Family MSP430 MSP430
Clock Frequency-Max 0.032 MHz 0.032 MHz
DAC Channels NO NO
DMA Channels YES YES
External Data Bus Width
Format FIXED POINT FIXED POINT
Integrated Cache NO NO
JESD-30 Code R-PDSO-G20 R-PDIP-T20
JESD-609 Code e4 e4
Length 6.5 mm 24.33 mm
Low Power Mode YES YES
Moisture Sensitivity Level 1 1
Number of DMA Channels 1 1
Number of I/O Lines 24 16
Number of Serial I/Os 2
Number of Terminals 20 20
Number of Timers 6 4
On Chip Data RAM Width 8 8
On Chip Program ROM Width 8 8
Operating Temperature-Max 85 °C 85 °C
Operating Temperature-Min -40 °C -40 °C
PWM Channels YES YES
Package Body Material PLASTIC/EPOXY PLASTIC/EPOXY
Package Code TSSOP DIP
Package Equivalence Code TSSOP20,.25 DIP14,.3
Package Shape RECTANGULAR RECTANGULAR
Package Style SMALL OUTLINE, THIN PROFILE, SHRINK PITCH IN-LINE
Peak Reflow Temperature (Cel) 260 260
Qualification Status Not Qualified Not Qualified
RAM (bytes) 256 256
RAM (words) 0.25 0.25
ROM (words) 4096 4096
ROM Programmability FLASH FLASH
Seated Height-Max 1.2 mm 5.08 mm
Speed 16 MHz 16 MHz
Supply Current-Max 0.42 mA 0.4 mA
Supply Voltage-Max 3.6 V 3.6 V
Supply Voltage-Min 2.2 V 2.2 V
Supply Voltage-Nom 2.2 V 2.2 V
Surface Mount YES NO
Technology CMOS CMOS
Temperature Grade INDUSTRIAL INDUSTRIAL
Terminal Finish Nickel/Palladium/Gold (Ni/Pd/Au) Nickel/Palladium/Gold (Ni/Pd/Au)
Terminal Form GULL WING THROUGH-HOLE
Terminal Pitch 0.65 mm 2.54 mm
Terminal Position DUAL DUAL
Time@Peak Reflow Temperature-Max (s) 30 30
Width 4.4 mm 6.35 mm
uPs/uCs/Peripheral ICs Type MICROCONTROLLER, RISC MICROCONTROLLER, RISC
Base Number Matches 2 1

Compare MSP430G2333IPW20 with alternatives

Compare MSP430G2332IN20 with alternatives